ISO 9001 Production

Laser Micro Drilling Services — Small Holes, High Aspect Ratios

Our laser micro drilling services are ideal for creating extremely small, high aspect ratio holes with consistent accuracy. We support complex designs and a wide range of materials, making it easier to achieve reliable results for demanding applications in electronics, medical devices, and precision engineering.

20μm Min. Diameter
20:1 Aspect Ratio
Zero Tool Wear
 laser micro drilling
THE CHALLENGE

Why Traditional Drilling Fails at Micro Scale

As devices shrink and tolerances tighten, conventional machining hits physical limits. Here's where mechanical drilling falls short—and how laser ablation bridges the gap.

Mechanical Limitations

  • â–¸Drill bits break below 50µm diameter
  • â–¸Tool wear causes dimensional drift
  • â–¸Mechanical stress deforms thin materials
  • â–¸Cannot drill angled holes efficiently
  • â–¸Burr formation requires secondary finishing

Laser Ablation Solution

  • â–¸No physical contact = no tool wear
  • â–¸Consistent hole quality from first to last
  • â–¸Zero mechanical force on workpiece
  • â–¸5-axis capability for any angle
  • â–¸Clean edges with minimal post-processing

Precision Micro Hole Manufacturing

We handle micro-drilling with a range of advanced laser setups. Our multi-axis scanning and trepanning equipment lets us control hole shape, taper angles, and surface quality down to the specifics.

Ultra-Small Diameters

Drill holes as small as 20 microns in diameter with exceptional precision. Our advanced focusing systems and ultrafast lasers enable creation of micro-features impossible with mechanical drilling methods.

Taper Control

Achieve zero-taper or controlled-taper holes using multi-axis scan heads and trepanning technology. Precise beam steering maintains perpendicular incidence for straight sidewalls throughout the hole depth.

Superior Surface Quality

Ultrafast laser pulses minimize heat-affected zones and recast layers, producing clean hole entrances, smooth sidewalls, and minimal debris for optimal flow characteristics and performance.

Advanced Micro Drilling Methods

We employ multiple laser drilling technologies optimized for different hole sizes, aspect ratios, and material requirements, ensuring optimal results for every application.

Trepanning Drilling

High Aspect Ratio Holes

Trepanning uses a rotating optical system to move the laser beam in a circular pattern, cutting the hole perimeter while maintaining perpendicular beam incidence. This technique excels at creating small-diameter holes (30-500µm) with high aspect ratios up to 10:1 and exceptional sidewall quality.

30-500µm Diameter Aspect Ratio 10:1 Zero Taper Smooth Sidewalls

Multi-Axis Scanning

Complex Geometries

Multi-axis scan heads enable drilling on curved surfaces and creation of angled holes. The system maintains optimal beam focus and incidence angle throughout the drilling process, enabling precise holes on cylindrical tubing, spherical surfaces, and complex 3D components.

Curved Surfaces Angled Holes 100-500µm Aspect Ratio 5:1

Fiber Laser Percussion

Ultra-Precision

Percussion drilling uses high-peak-power nanosecond pulses from an IPG fiber laser source, delivering controlled energy at a fixed point to ablate material efficiently. Ideal for micro-holes 50–500 μm in metals and select alloys where industrial precision and throughput are prioritized over sub-micron thermal control.

50–500 μm Diameter Controlled Heat Zone Metals & Alloys Industrial Grade

Helical Drilling

Large Diameter Deep Holes

Helical drilling combines rotation and translation of the laser beam in a spiral pattern, efficiently removing material from large-diameter deep holes. This method provides excellent control over hole geometry and is ideal for applications requiring substantial flow capacity.

100µm-1mm Deep Holes High Throughput Controlled Profile
SUCCESS STORIES

Real Parts, Real Results

See how we've solved micro drilling challenges across industries—from life-saving medical devices to mission-critical aerospace components.

25µm
Hole Diameter
Medical Device

Drug Delivery Catheter

A pharmaceutical client needed 25µm holes in a PEEK catheter wall for controlled drug release. Mechanical drilling was impossible at this scale.

Solution:
UV laser at 355nm with trepanning strategy. 500 holes per catheter, ±5µm positional accuracy.
±5µm Tolerance
10:1 Aspect Ratio
50µm
Hole Diameter
Semiconductor

Through-Glass Via (TGV)

An IC packaging company required high-density vias through 300µm borosilicate glass for advanced packaging applications.

Solution:
Femtosecond laser with helical drilling. 6:1 aspect ratio with <2° taper angle.
6:1 Aspect Ratio
<2° Taper
200µm
Hole Diameter
Aerospace

Turbine Blade Cooling

An aerospace manufacturer needed angled cooling holes in Inconel turbine blades with TBC coating—impossible with EDM due to coating damage.

Solution:
5-axis nanosecond laser at 15° angle. Clean breakthrough without delamination.
15° Angle
TBC Coating
Services

Laser Micro Drilling Applications We Serves

High-precision micro-hole & micro-channel drilling solutions for semiconductor, aerospace, electronics and medical industries.

Semiconductor Wafer Micro Drilling
01

Semiconductor Wafer Drilling

Micron drilling for silicon wafers & compound semiconductors

Aerospace Cooling Plate
02

Aerospace Cooling Plate

Complex micro-channel drilling for aerospace thermal management

PCB Micro Via Drilling
03

PCB Micro Via Drilling

Ultra-fine blind & through via drilling for HDI circuit boards

Microfluidic Chip
04

Microfluidic Chip

Channel drilling for lab-on-a-chip & medical devices

Decision Guide

Is Laser Drilling Right for Your Project?

Compare laser drilling capabilities against your project requirements to determine the best manufacturing approach.

Decision Factor
Choose Laser Drilling
Consider Alternatives
Not Sure? Ask Us
Hole Size
Under 20µm diameter
Exceeds 1mm diameter
Material compatibility testing
Material Thickness
Thin/fragile materials
Exceeds 10mm thickness
Sample part evaluation
Precision Needs
Burr-free edges required
Tolerance ±1µm needed
Process development services
Cost & Volume
High hole density required
Cost/volume critical (>1M parts)
Cost modeling & pricing
Process Needs
Angled holes / minimal thermal damage
Low laser absorption / Ra <0.1µm finish
Design review & lead time estimates

Ready to Drill the Impossible?

Send us your drawing or describe your challenge. We’ll tell you if laser micro drilling is the solution—and if not, we’ll recommend the right process.

Quote Process

1
Submit your requirements
2
We review and analyze (24h)
3
Receive detailed quote
Request a quote Now!

For files larger than 20MB, please send to: sales@lasermicrofab.com with your contact information

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