Laser Micro Drilling Services — Small Holes, High Aspect Ratios
Our laser micro drilling services are ideal for creating extremely small, high aspect ratio holes with consistent accuracy. We support complex designs and a wide range of materials, making it easier to achieve reliable results for demanding applications in electronics, medical devices, and precision engineering.
Why Traditional Drilling Fails at Micro Scale
As devices shrink and tolerances tighten, conventional machining hits physical limits. Here's where mechanical drilling falls short—and how laser ablation bridges the gap.
Mechanical Limitations
- ▸Drill bits break below 50µm diameter
- â–¸Tool wear causes dimensional drift
- â–¸Mechanical stress deforms thin materials
- â–¸Cannot drill angled holes efficiently
- â–¸Burr formation requires secondary finishing
Laser Ablation Solution
- â–¸No physical contact = no tool wear
- â–¸Consistent hole quality from first to last
- â–¸Zero mechanical force on workpiece
- â–¸5-axis capability for any angle
- â–¸Clean edges with minimal post-processing
Precision Micro Hole Manufacturing
We handle micro-drilling with a range of advanced laser setups. Our multi-axis scanning and trepanning equipment lets us control hole shape, taper angles, and surface quality down to the specifics.
Ultra-Small Diameters
Drill holes as small as 20 microns in diameter with exceptional precision. Our advanced focusing systems and ultrafast lasers enable creation of micro-features impossible with mechanical drilling methods.
Taper Control
Achieve zero-taper or controlled-taper holes using multi-axis scan heads and trepanning technology. Precise beam steering maintains perpendicular incidence for straight sidewalls throughout the hole depth.
Superior Surface Quality
Ultrafast laser pulses minimize heat-affected zones and recast layers, producing clean hole entrances, smooth sidewalls, and minimal debris for optimal flow characteristics and performance.
Advanced Micro Drilling Methods
We employ multiple laser drilling technologies optimized for different hole sizes, aspect ratios, and material requirements, ensuring optimal results for every application.
Trepanning Drilling
High Aspect Ratio HolesTrepanning uses a rotating optical system to move the laser beam in a circular pattern, cutting the hole perimeter while maintaining perpendicular beam incidence. This technique excels at creating small-diameter holes (30-500µm) with high aspect ratios up to 10:1 and exceptional sidewall quality.
Multi-Axis Scanning
Complex GeometriesMulti-axis scan heads enable drilling on curved surfaces and creation of angled holes. The system maintains optimal beam focus and incidence angle throughout the drilling process, enabling precise holes on cylindrical tubing, spherical surfaces, and complex 3D components.
Fiber Laser Percussion
Ultra-PrecisionPercussion drilling uses high-peak-power nanosecond pulses from an IPG fiber laser source, delivering controlled energy at a fixed point to ablate material efficiently. Ideal for micro-holes 50–500 μm in metals and select alloys where industrial precision and throughput are prioritized over sub-micron thermal control.
Helical Drilling
Large Diameter Deep HolesHelical drilling combines rotation and translation of the laser beam in a spiral pattern, efficiently removing material from large-diameter deep holes. This method provides excellent control over hole geometry and is ideal for applications requiring substantial flow capacity.
Real Parts, Real Results
See how we've solved micro drilling challenges across industries—from life-saving medical devices to mission-critical aerospace components.
Drug Delivery Catheter
A pharmaceutical client needed 25µm holes in a PEEK catheter wall for controlled drug release. Mechanical drilling was impossible at this scale.
Through-Glass Via (TGV)
An IC packaging company required high-density vias through 300µm borosilicate glass for advanced packaging applications.
Turbine Blade Cooling
An aerospace manufacturer needed angled cooling holes in Inconel turbine blades with TBC coating—impossible with EDM due to coating damage.
Laser Micro Drilling Applications We Serves
High-precision micro-hole & micro-channel drilling solutions for semiconductor, aerospace, electronics and medical industries.
Semiconductor Wafer Drilling
Micron drilling for silicon wafers & compound semiconductors
Aerospace Cooling Plate
Complex micro-channel drilling for aerospace thermal management
PCB Micro Via Drilling
Ultra-fine blind & through via drilling for HDI circuit boards
Microfluidic Chip
Channel drilling for lab-on-a-chip & medical devices
Is Laser Drilling Right for Your Project?
Compare laser drilling capabilities against your project requirements to determine the best manufacturing approach.
Ready to Drill the Impossible?
Send us your drawing or describe your challenge. We’ll tell you if laser micro drilling is the solution—and if not, we’ll recommend the right process.
Quote Process
For files larger than 20MB, please send to: sales@lasermicrofab.com with your contact information
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