ISO 9001 Production

Laser Micro Marking Services— Permanent "ID Card"

Marking puts permanent identification on material surface —
can be text, numbers, QR codes, logos.

Why laser marking?
- Permanent: Won't peel like labels, won't fade like ink
- Non-contact: Won't damage precision parts
- High precision: Can mark 0.1mm characters

Non-Contact Processing
Traceable Identification
Wide Material Compatibilit
Laser Micro Marking Services | Traceability image

Our Laser Micro Marking Solutions

No labels, no ink. We burn permanent marks directly into the surface—fiber for metals, The marks stay readable through every downstream process you throw at them. Traceability, compliance, done.

Permanent Marking

Non-contact laser marking creates indestructible identifiers that withstand extreme temperatures, chemicals, sterilization, and mechanical wear throughout the product lifecycle.

Micro Precision

Achieve feature sizes down to 20µm with ±5µm positioning accuracy. Perfect for micro-marking on small medical implants, semiconductor dies, and precision components.

Regulatory Compliant

Full FDA UDI compliance, ISO 13485 medical certification, and ITAR registration. Our marking processes meet the strictest industry standards for traceability and quality.

Laser Marking Applications Across Industries

Our laser micro marking services cater to diverse industries with specialized requirements for precision, durability, and regulatory compliance. From medical UDI marking to aerospace traceability, we deliver solutions that meet the most demanding standards.

Medical Devices

  • FDA UDI Compliance
  • Surgical Instruments
  • Implants & Prosthetics
  • Catheters & Tubing
  • Medical Electronics

Aerospace

  • AS9100 Compliance
  • Turbine Components
  • Fasteners & Fittings
  • Engine Parts
  • ID Plates & Labels

Semiconductor

  • Wafer Marking
  • Die Identification
  • Package Labeling
  • Lead Frame Marking
  • Test Socket IDs

Automotive

  • VIN Marking
  • Engine Components
  • Transmission Parts
  • EV Battery Systems
  • Safety Components
Services

Laser Micro Welding for Critical Components

We deliver clean, permanent, high-resolution laser marking for delicate components used in semiconductor, automotive, watch, and battery industries.

Semiconductor Wafer Marking
01

Semiconductor Wafer Marking

High-precision laser marking for semiconductor wafers and components

Watch Movement Micro Marking
02

Watch Movement Marking

Ultra-fine laser marking for precision watch movement parts

Aerospace Fastener Micro Marking
03

Aerospace Fastener Marking

Durable laser marking for aerospace fasteners and components

Battery Tab Micro Marking
04

Battery Tab Marking

High-speed laser marking for battery tabs and connectors

The above showcases only a selection of parts we mark for our customers. If you need marking for other components, feel free to request a free quote.

Request a Free Quote

Marking on Virtually Any Material

Our diverse laser technologies enable permanent marking on a wide range of materials, from metals and alloys to plastics, ceramics, and composites.

Comprehensive Material Processing Capabilities

Whether you need marking on stainless steel surgical instruments, titanium orthopedic implants, or PEEK polymer components, our multi-wavelength laser systems deliver optimal results. We match the right laser technology to your specific material for maximum contrast, durability, and quality.

Metals & Alloys

  • Stainless Steel (300/400 series)
  • Titanium & Ti-6Al-4V
  • Aluminum & Alloys
  • Nitinol
  • Cobalt-Chrome
  • Brass & Copper

Plastics & Polymers

  • PEEK
  • PTFE (Teflon)
  • Polycarbonate
  • ABS
  • Nylon
  • Medical-grade plastics

Hard Materials

  • Sapphire
  • Quartz
  • Diamond
  • Ceramics
  • Alumina
  • Zirconia

Coated Materials

  • Anodized Aluminum
  • Powder-coated Metals
  • Painted Surfaces
  • Plated Components
  • Thin Films
  • Passivated Steel
Laser marking on various materials
50+
Materials Processed

The LaserMicroFab Advantage

With over a decade of experience in precision laser micromachining, we combine cutting-edge technology with rigorous quality control to deliver marking solutions that exceed industry standards.

01

Micron Precision

Achieve positioning accuracy of ±5µm with feature sizes down to 20µm. Our advanced motion systems and vision alignment ensure consistent, repeatable results.

02

Full Regulatory Compliance

ISO 9001 and ITAR registered. Our processes meet FDA UDI requirements, AS9100 aerospace standards, and semiconductor industry specifications.

03

Multiple Laser Technologies

Fiber laser systems provide the right solution for every material and application, from annealing to deep engraving.

04

In-House Validation

Comprehensive mark verification including readability testing, contrast measurement, and durability validation to ensure 100% compliance.

05

Rapid Turnaround

Prototype samples in 3-5 days, production volumes with industry-leading lead times. Global supply chain ensures on-time delivery.

06

Engineering Partnership

Collaborate with our 17+ skilled engineers from design to production. We optimize your marking design for manufacturability and cost efficiency.

Laser Micro Marking Capabilities

Our state-of-the-art laser marking systems deliver precision and consistency for the most demanding applications.

±5µm
Positioning Accuracy
High-precision motion systems with closed-loop feedback
20µm
Minimum Feature Size
Micro-marking for small components and dies
1000×
DPI Resolution
Ultra-high resolution for detailed graphics
2.5k
Marking Speed (mm/s)
High-speed galvo scanning for production

Customer Success: Semiconductor Wafer Laser Marking

How we delivered clean, damage‑free laser marking for semiconductor wafers that stands up to high‑temp processing.

Semiconductor Wafer Laser Marking Semiconductor Wafer Laser Marking Process
Case Study

Damage-Free Laser Marking for Semiconductor Wafers

Project Challenge: A semiconductor fabrication team required full-traceability marking on 8-inch silicon wafers. Traditional laser processes risked micro-cracks, thermal damage, and mark fading during high-temperature wafer fabrication steps — critical failures for semiconductor manufacturing standards.

Our Solution: We deployed an ultrafast picosecond laser system with non-thermal processing technology. The low-heat marking process eliminates substrate damage, while our precision optics deliver consistent, high-contrast marks across the entire wafer surface.

Final Results: Zero wafer damage, 100% mark readability after thermal processing, and 10µm ultra-precise marking. The solution fully complied with semiconductor industry traceability standards and passed all production validation tests.

100%
Readability Rate
8"
Wafer Size
10µm
Mark Precision

Explore Laser Micro Marking FAQs

FAQ

What is the minimum feature size you can achieve with laser marking?

Our advanced laser systems can achieve feature sizes as small as 20µm with positioning accuracy of ±5µm. This enables micro-marking on small medical implants, semiconductor dies, and precision components where space is limited.

Yes, our laser marking processes are fully compliant with FDA UDI requirements under 21 CFR 801.45. 

We can mark virtually any material including stainless steel, titanium, aluminum, nitinol, cobalt-chrome, PEEK, PTFE, polycarbonate, ABS, sapphire, quartz, ceramics, and coated materials. Our multi-wavelength laser systems ensure optimal results for each material type.

Laser marks are permanent and can withstand extreme conditions including high temperatures, chemicals, abrasion, and repeated sterilization cycles. Our marks have been validated to survive 500+ autoclave cycles for medical applications and extreme aerospace environments.

Prototype samples are typically delivered within 3-5 business days. Production lead times vary based on volume and complexity, but we maintain industry-leading turnaround times. Rush services are available for urgent requirements.

Request a Laser Micromachining Quote Today!

Tell us about your project and receive a detailed quote within 24 hours. Our engineering team is ready to help solve your precision manufacturing challenges.

Quote Process

1
Submit your requirements
2
We review and analyze (24h)
3
Receive detailed quote
Request a quote Now!

For files larger than 20MB, please send to: sales@lasermicrofab.com with your contact information