Custom part manufacturing
Laser-cut semiconductor lead frames from your drawing in copper and low-expansion alloys—giving development teams a direct, tooling-free route from design revision to a real part.
Choosing a process
Each process has a sensible place. Laser cutting is built for the stages where designs are changing, fine details need review, and the cost or delay of hard tooling does not fit the project.
| Process | Tooling to start | Design changes | Best fit |
|---|---|---|---|
| Stamping | Custom progressive die | New or modified tooling | Mature, high-volume standard frames |
| Photochemical etching | Phototool per design | New mask for each revision | Dense thin arrays and some prototypes |
| Laser cutting | No dedicated die; cut from file | A revision is a file change | Prototypes, pilot builds, fine or custom geometry |
For mature high-volume frames, stamping is economical. We support the work before and around that point: prototype iterations, complex geometries, fine-pitch features, and quick-turn custom production.
Material selection
Lead frame material is selected around the package, balancing electrical and thermal conductivity against thermal-expansion match and mechanical stability.
Pure copper, brass, phosphor bronze, beryllium copper
Best for: thermal performance and current-carrying applications.
Controlled-expansion alloys for reliability-driven packages
Best for: hermetic, optical, and CTE-sensitive package designs.
We finish the base frame with clean, burr-controlled, oxide-aware edges to support subsequent plating, wire bonding, and solderability requirements.
Quality
The values below provide an engineering starting point. The usable limit is confirmed against material, gauge, geometry, flatness needs, and inspection requirements.
| Parameter | Process capability |
|---|---|
| Fine features | From 0.015 mm, reviewed against alloy, gauge, and frame geometry |
| Cut kerf | To 0.01 mm on qualified thin-gauge material |
| Dimensional positioning | ±0.005 to 0.02 mm, based on drawing requirements |
| Controlled heat zone | Typically 0.05 to 0.2 mm to limit distortion |
| Material families | Copper alloys, Alloy 42, Kovar, Invar, and other specified metals |
| Production fit | Prototype, validation lots, pilot builds, and repeat custom production |
Applications
Thin-gauge custom frames for common leaded and no-lead package families, supplied in prototype and pilot quantities.
Fine-pitch peripheral leads for high-pin-count packages.
Small-outline leaded package frames.
No-lead pad and terminal frames with thermal paths.
Through-hole leaded frames and custom pin layouts.
Heavier copper paths for current carrying and heat transfer.
Custom and asymmetric frames for sensing and optical packages.
How it works
Answers
Yes. Send the package outline available, die-paddle and lead intent, material and gauge, critical pitch or datum relationships, finishing needs, and quantity. We can identify which geometry should be controlled before the drawing is released.
Yes. We review the die paddle, leads, tie bars, dam bars, outer strip, and locating features as one drawing-defined component. This is useful for asymmetric, non-standard, and development package layouts.
Features can begin at approximately 0.015 mm with kerf to 0.01 mm, subject to material, thickness, frame layout, and flatness requirements. We review the complete geometry rather than quote a pitch limit in isolation.
We machine and finish the base frame with clean, burr-controlled edges prepared for downstream plating. Silver spot, NiPdAu, and other plating requirements can be coordinated to the drawing and package process.
Heat input, cut sequence, and fixturing are set to limit distortion in thin material. Critical feature position and specified flatness are checked against the agreed drawing datum and inspection plan before delivery.
Custom lead frames
Send your drawing with material, gauge, critical features, and quantity. We will review it for manufacturability and recommend a practical route.
