MEMS Laser Micromachining Services for Metal Components & Tooling
Precision laser micromachining services for MEMS metal package components, fine features, carriers, test hardware, and production tooling—from feasibility review through repeatable production.
- ±1μmAccuracy
- 300mmWafer Size
- 99.9%Yield Rate
MEMS Metal Component Specifications
We support MEMS metal package and tooling projects with specification-driven processes for controlled geometry, clean edges, and repeatable inspection.
Detailed Processing Capabilities
| Process Parameter | Specification | Application Benefit |
|---|---|---|
| Laser Type | Fiber Laser (Nanosecond Pulsed / CW) | Controlled thermal input for stable processing |
| Wavelength | 1064 nm | Optimized for metal absorption and industrial reliability |
| Material Thickness | 0.025 mm – 3 mm | Thin-gauge to medium-thickness substrates |
| Scan Speed | Up to 5 m/s | High-throughput production |
| Repeatability (3σ) | ±5μm | Consistent batch quality |
| Cleanroom Class | ISO 5 (Class 100) | Contamination-free processing |
MEMS Applications We Serve
From acoustic components to precision sensing devices, we manufacture high-precision micro components for the MEMS industry.
MEMS Microphones
Acoustic cavities, sound inlet holes, diaphragm structures
MEMS Pressure Sensors
Pressure ports, diaphragm features, bonding structures
Inkjet Nozzles
Precision orifices, nozzle arrays, flow channel structures
MEMS Accelerometers
Proof mass structures, flexure beams, sensing element features
What Sets Us Apart
We have built our reputation on technical excellence, transparent communication, and measurable results for precision manufacturers worldwide.
Controlled Heat Input Processing
Our IPG fiber laser systems deliver precise energy deposition with optimized pulse parameters, minimizing heat-affected zones in thin-gauge metals. Controlled thermal management preserves material integrity for micro-scale features and tight-tolerance assemblies.
Multi-Material Metal Capability
Process stainless steel, titanium, aluminum, and nickel alloys without changing equipment or losing alignment. Our systems handle complex metal stacks and dissimilar material joints in one continuous operation, eliminating inter-layer registration errors.
Proven Production Scale
We do not just do prototypes. Our facilities process high-volume precision metal components annually with 99.2% first-pass yield. SPC monitoring, full traceability, and automated inspection ensure consistent quality at volume.
Application Engineering Support
Our engineers have 8+ years average experience in laser micro manufacturing. We provide DFM feedback, process optimization, and joint development support—not just order fulfillment. Your success is our success.
Frequently Asked Questions
Get answers to common questions about our MEMS laser micromachining services
What is MEMS?
MEMS (Micro-Electro-Mechanical Systems) are miniature integrated devices that combine electrical and mechanical components at the micro scale. They are widely used in sensors, actuators, microphones, gyroscopes, and medical devices.
Which MEMS metal components and materials do you support?
We support precision metal package components and tooling in stainless steel, titanium, nickel alloys, copper, Kovar, Invar, and other application-specific metals. The process review focuses on the component geometry, material condition, edge requirements, and inspection method.
What is your production capacity?
Our current production capacity exceeds 500,000 MEMS units annually, with the ability to scale to 1M+ units for high-volume programs. We support both low-volume prototyping (as low as 10 units) and full-scale production runs.
Can you fabricate silicon MEMS dies?
No. Silicon wafer fabrication, photolithography, deposition, and die-level etching belong to a MEMS foundry or semiconductor cleanroom. Our work supports the precision metal hardware around the completed die: packaging components, carriers, sockets, fixtures, and tooling.
Where does laser micromachining fit in MEMS production?
Our laser micromachining work supports the metal side of MEMS production: lead frames, lids, shields, hermetic-seal parts, carriers, test sockets, assembly jigs, and fine metal features that must fit and perform around the die.
Why is laser micromachining important for MEMS devices?
What is the difference between MEMS and traditional sensors?
Laser micromachining is used for MEMS wafer dicing, via drilling, trench etching, structure patterning, chip singulation, and creating micro-channels, cantilevers, and sensitive mechanical structures.
How does laser micromachining support MEMS metal components?
MEMS sensors are much smaller, lower power, more cost-effective in mass production, and suitable for integration into compact electronic systems compared to traditional macroscopic sensors.
Ready to Manufacture Your MEMS Devices?
Get a detailed quote for your MEMS laser micromachining project. Our engineering team will review your design and provide manufacturing recommendations within 24 hours.
Quote Process
For files larger than 20MB, please send to: sales@lasermicrofab.com with your contact information
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