Semiconductor Test Probe: 0.07 mm Pitch Case Study
What We Cut
These are test probes for semiconductor packaging. Line width runs 0.1 mm, pitch is 0.07 mm, and the serpentine pattern makes them unforgiving. Heat the material wrong by even a few degrees and the pitch drifts. We cut these cold, hold the tolerance, and ship them in batches that match the first article.
The Hard Part
The serpentine structure is where most processes fail. Standard laser cutting puts enough heat into the probe to deform the winding pitch. That kills electrical contact consistency. The client needed zero pitch deformation across the entire pattern, not just on the straight sections.
How We Held It
We run these on a femtosecond line. Pulse duration is short enough to ablate without throwing heat into the surrounding material. No heat-affected zone, no pitch drift. We also fixture the raw strip under tension so the serpentine winds do not relax or shift between cuts.
Numbers That Matter
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This page documents one completed project. For your own material, geometry, tolerance, inspection, and volume requirements, review the relevant production capability before requesting a feasibility review.
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