Board support
Board outline, thickness, flexible areas, and approved contact zones determine where the carrier can support the assembly without touching solderable features.
Laser-machined metal carrier parts and reflow fixture features for board support, repeatable registration, component clearance, and controlled handling through your SMT process.

Start with the assembly
A reflow fixture is a process component. The board stack, component envelope, conveyor interface, and thermal profile need to be considered together before the carrier geometry is released. See the ±0.02 mm locating-hole reflow fixture case study for a project-level example of registration and post-cycle flatness verification.
Board outline, thickness, flexible areas, and approved contact zones determine where the carrier can support the assembly without touching solderable features.
Component heights, connector overhang, bottom-side population, and keep-out areas define the relief windows, pockets, and exposed solder regions.
Tooling holes, datum edges, conveyor direction, and loading orientation should be referenced from the same drawing datum.

Material & thermal fit
Material selection is a balance between stiffness, thermal behavior, required feature size, cleaning environment, and the way the fixture supports the assembly.
Production release
Inspection should focus on the finished conditions that control board seating and process repeatability, rather than applying the same requirement to every contour.

Common uses

Carrier features that reduce board sag while maintaining clearance around populated areas.

Controlled registration and relief geometry for assemblies where placement and solder-joint access matter.

Tooling-free metal fixture parts for proving the board, fixture, and oven interface before a repeat build.

Drawing-defined carriers, masks, supports, and fixture subcomponents for non-standard production flows.
Prepare your review
Include the board outline, component envelope, support and clearance zones, datum features, expected oven conditions, material preference, inspection needs, and quantity.
Answers
Please send the PCB outline or Gerber/DXF data, board thickness, component-height information, bottom-side population map, required support areas, datum and tooling features, oven conditions, material preference, and quantity.
The fixture must be reviewed around the actual oven profile, thermal mass, board geometry, and required process outcome. A metal part can add stiffness and durable locating features, but it can also change heating behavior; validate representative assemblies before production release.
Apply controlled tolerances to features that determine board seating and process registration: datums, tooling holes, critical reliefs, and support locations. Wider tolerances may be suitable for non-functional contours and handling cutouts.
We can review laser-machined metal carrier parts, plates, masks, shims, and drawing-defined fixture features. Complex assembled tooling, non-metal components, clamps, and final thermal validation should be scoped against the complete fixture design.