Paste Volume
Foil thickness and aperture area establish the deposit available to each component.
Custom part manufacturing
Precision laser-cut apertures, selected foil thickness, and paste-release-focused finishing for prototype through production PCB assembly.

The print begins here
Before reflow, the stencil determines where paste lands and how much reaches each PCB pad. Aperture wall condition, thickness, and geometry affect transfer efficiency long before printer settings or reflow profiling can help.
Foil thickness and aperture area establish the deposit available to each component.
Wall geometry and surface condition determine how consistently paste leaves the aperture.
Flatness, registration, and a practical frame configuration support stable print cycles.

Aperture engineering
Small apertures do not automatically print well. Their opening size must be considered with foil thickness, area ratio, aspect ratio, component pitch, and the paste process.
We review reductions, rounded corners, home-plate forms, and other aperture changes against the intended component and paste-volume objective.
Material & finish
304 stainless steel is the reliable baseline for most laser-cut SMT stencils. For demanding transfer at the smallest pitches, electroformed nickel or a specified coating may be the better process decision.
The workhorse foil for stable tension, clean laser cutting, and broad production use.
Smoother, naturally tapered aperture walls for highly demanding ultra-fine-pitch transfer.
Optional paste-release treatment for fine-pitch or high-cycle lines where cleaning intervals matter.

Laser process
Laser cutting gives direct control of every aperture path without a phototool. It is especially useful for prototypes, engineering changes, fine-pitch boards, and controlled custom panel layouts.

For a fast review
Answers
Gerber paste layers are the normal starting point. Please also send the board outline or panel drawing, foil thickness, framed or frameless requirement, fiducial and tooling-hole requirements, and any aperture changes already defined by your process team.
Thickness follows the smallest aperture and the paste-volume needs of the board. Fine-pitch parts often need 0.08–0.10 mm foil, while larger components may need more volume. For conflicting needs on one board, we review whether a step stencil is justified.
Yes, subject to pad geometry, foil thickness, aperture reduction, and transfer-ratio review. The aperture is evaluated as a paste-release feature, not merely copied from the pad.
Nano coating can be specified to reduce paste adhesion and extend cleaning intervals on demanding fine-pitch or high-cycle production. It is applied to a well-cut stencil; it does not substitute for appropriate aperture geometry.
For ultra-fine pitches and demanding paste transfer below about 0.3 mm pitch, electroformed nickel may be the more suitable route because of its smooth, naturally tapered aperture walls. We will flag that boundary during review.
Custom SMT stencils
Share your files, foil preference, critical component pitch, and printer format. We will review the aperture and configuration choices before release.