Outer Profile and Opening
Circular frames, custom outer shapes, and non-standard openings can be cut directly from the approved drawing.
Custom Wafer Frames for Dicing and Die Attach
Laser-cut metal wafer frames for dicing-tape mounting and semiconductor handling. Share the frame geometry, material, handling interfaces, and critical requirements; we make custom frames for prototypes, qualification lots, and repeat production.
- Standard or custom ring diameters, openings, and outer profiles
- Flats, notches, and alignment features cut to drawing
- Material, flatness, and tape-contact requirements reviewed together
Frame geometry
Specify the Details That Control Equipment Fit
Custom frames are made from the drawing, so the useful conversation is about the features your equipment uses, not a generic catalogue size.
Flats, Notches, and Locators
Orientation details are positioned from the stated datum so the frame can register with automated handling equipment.
Material and Thickness
Specify the required stainless grade and stock thickness so equipment fit and handling needs can be reviewed together.
Material and process
Materials, Edge Condition, and Tooling Choice
The stainless grade and finished edge should be selected around the equipment and process. Laser cutting is particularly useful while a custom frame geometry is still being qualified.
304 Stainless Steel
A common option where corrosion resistance and stable processing-frame handling are important. The final grade is reviewed with the equipment and drawing requirements.
430 Stainless Steel
An option to consider when the handling system needs a magnetic frame. Environment, finish, and equipment compatibility are reviewed before production.
Drawing-Defined Finish
Deburring, edge condition, surface treatment, and cleaning requirements are considered as part of the complete frame specification.
Tooling-Free Laser Cutting
A direct-from-file route for prototypes, qualification lots, custom variants, and revisions before hard tooling makes sense.
For a mature, very high-volume standard frame, hard tooling may be the more economical option. Laser cutting supports the prototype, qualification, revision, and custom work around that point.
Quality for frame handling
Define Flatness and Edge Requirements Early
Flatness and edge condition affect how the tape and frame are handled. Calling out those requirements early gives the production and inspection plan a clear target.
- Flatness for the frame plane. State the allowed condition where the process needs controlled tape support.
- Tape-contact edges. Identify the edge condition and any deburring or finish requirement for mounting and handling.
- Agreed acceptance criteria. Align visible, surface, and inspection needs with the specific frame drawing.
Applications
Wafer Frames for Standard and Custom Workflows
Custom metal frames can be adapted to the wafer, substrate, handling equipment, and process stage that surrounds the part.
Wafer Dicing and Die Attach
Frames for tape mounting, singulation, expansion, and preparation for downstream die handling.
MEMS and Compound Substrates
Custom openings and locating features for non-standard wafers, carriers, and substrate configurations.
R&D and Qualification Builds
Tooling-free frames for proving equipment fit, evaluating a new geometry, and establishing a production drawing.
Repeat Custom Production
Controlled custom parts for established workflows where a standard stamped ring is not the right fit.
Start with what you have
What to Send for a Wafer Frame Quote
A finished production drawing is useful, but an early concept or an existing frame can be enough to begin a manufacturability review.
Make the review more useful
Clear information about the equipment interface and handling process helps us recommend a practical material, geometry, edge condition, and manufacturing route.
Send your wafer frame details- An approved drawing, recognized frame standard, or a clear sketch
- Outer profile, opening, flats, notches, and orientation details
- Material, thickness, and any magnetic-handling requirement
- The equipment or process interfaces that determine frame fit
- Flatness, tape-contact edge, finish, and cleanliness requirements
- Prototype, qualification, or repeat-production quantity
Answers
Wafer Frame FAQs
Can you make standard wafer frame sizes?
Yes. We can review a recognized equipment standard or work directly from your approved drawing. Please include the frame size, opening, material, thickness, and any locating features used by your process.
Can you make a non-standard wafer frame?
Yes. Laser cutting is well suited to custom outer profiles, openings, flats, notches, and low-volume variants. We review the complete geometry against the specified material and handling requirements before production.
Which stainless steel should I specify?
The choice follows the equipment and environment. 304 can be considered where corrosion resistance is important, while 430 can be considered when magnetic handling is required. We will review the requested grade with the drawing and process details.
How do you handle flatness and tape-contact edges?
Flatness, edge condition, and any surface or cleaning requirement should be stated on the drawing. We review the stock, cut sequence, and finishing approach against those agreed requirements, then check the critical features to the inspection plan.
When is laser cutting a better fit than stamping?
Laser cutting avoids a dedicated stamping die, so it is a practical route for prototypes, design revisions, qualification lots, and custom production. For a stable, very high-volume standard design, hard tooling may be the more economical option.
Custom wafer frames
Start Your Wafer Frame Project
Send the drawing or frame standard, material, critical dimensions, process interface, and quantity. We will review the practical route for your custom frame.